Responsibilities: Manage TPM (Total Productive Maintenance) program across all wafer fab equipment. Person will be dedicated to defining and managing the TPM program working with process and tool owners in every operations department. Program manager to establish a cohesive equipment improvement effort will free time from process area managers to focus other key issues without sacrificing the close equipment and process engineering organization structure. Job objectives include: (1) Measure and manage OEE metrics, (2) Drive key TPM projects that affect all process areas, (3) Work with process and manufacturing managers to address bottleneck tool modeling and efficiencies, (4) Train and mentor Equipment Engineers and technicians on use of TPM methodology, (5) Improve equipment productivity and reduce costs over time, (6) Report TPM program progress to management and other LSI sites, (7) Benchmark and use best TPM methods from industry and other LSI sites, (8), Develop new TPM methods and supporting systems. As senior member of the process engineering team, train and mentor development of junior engineers. Champion TPM methodoly for Gresham and LSI. Requirements: Knowledge of wafer fab processes and equipment. Ability to manage long term improvement programs. Understanding of TPM methods and practical approaches to equipment maintenance in a wafer fab. Ability to work with engineers and management in a matrix reporting structure. Equipment: Fast SPC, X-Site, Factoryworks, Dataase, Probolem solving and Problem analysis methodologies, SPC. Education: BS, MS or PhD degree in EE, ChE, IE, ME or related field. 5+ years experience in wafer fgab operations or maintenance. Experience in running cross functional programs.